Catégorie

Fabrication de semi-conducteurs et d'autres composants électroniques

A propos de nous

C-MAC Industries Inc. is a global manufacturer of advanced microelectronic modules, electronic system assemblies on ceramic substrate (hybrid circuits) or PCB.We are specialized in high reliability product. We serve automitive, medical industrial and electronic market.The MicroTechnology Division has a total of 3 facilities in Canada, the United Kingdom and Belgium. It is one of the world's leading suppliers of microelectronic modules. With extensive design and manufacturing experience in thick film substrates, surface mount hybrids, chip and wire hybrids, and multi-chip modules, we offer integrated microelectronic solutions to a range of complex system challenges. Our customers are many of the world's leading telecommunications, defense, aerospace, automotive and medical manufacturers, with whom we have developed strategic partnerships over a number of years.·QualityOur success reflects the creativity and innovation of our engineers, the skills and flexibility of our operators and the ability of our management to fulfill the needs of our customers and of the business. This is reinforced through our commitment to continuous improvement. The dedication to building Quality product is fundamental and is reflected in our wide range of international approvals, including ISO 9001, ISO16949, ISO13485, MIL STD 1772A and BS 9450, plus many individual customer certifications. Control of key variables by real-time Statistical Process Control (SPC) is complemented by design and process Failure Mode and Effect Analysis (FMEA) and product simulation.·EngineeringClose cooperation with customers has always provided a strong base for product development and with state-of-the-art CAE and CAD systems, we offer simulated, electronic and thermal performance at the earliest project stages. Working partnerships and engineering team ownership of product developments are instrumental in satisfying the customers' exact requirements. In addition to the extensive circuit design and hybrid layout skills available from the C-MAC engineering teams, our considerable experience in silicon design enables cost-effective ASIC solutions to a wide variety of electronic packaging requirements.·ManufacturingOne of our key objectives is to continually improve levels of customer service and to satisfy the customers' exact requirements at a competitive price through the application of world class manufacturing methods. Our state-of-the-art manufacturing facilities bring together a wide range of thick film processes, automated equipment and multi-functional employees to provide a benchmarked manufacturing capability which successfully meets the stringent requirements of our customers. Statistical Process Control is used in most manufacturing processes. Our commitment to the environment has seen the elimination of ozone depleting substances from all manufacturing processes.·Solutions (Wide Range of Technologies & Capabilities) - Custom hybrid thick film microcircuits & resistor networks; - Low Cost, Compact & Reliable Resistor Network Product Line; - Battery Feed Resistors & Thermal Fuse Networks (Line Feed resistors); - SMT, MCM (Multi Chip Module), Chip & Wire and Chip-On-Board technologies; - Military & Space Microcircuits (1553, 3910 & 1760 Databus Controllers); - DC/DC Converters : for Military, commercial and telecom applications; - Analog Active and Passive Video Filters; - Heating elements on proprietary metal substrates; - Sealed packaging, power packages, metal cavity, ISP with ceramic / metal lids, low cost conformal coating; - LTCC, diffusion patterning, FODEL, RF expertise, C02 laser scribing, machining & drilling, ASIC design (all technologies); - (For more detailed information, SEE OUR SITE at: www.cmac.ca)·The FutureThe Way Forward C-MAC's MicroTechnology are committed to continual investment in both engineering and process development to ensure that we are able to offer state-of-the-art technical solutions to the electronics industry well into the next century. Our engineers are actively involved in process development for fine line printing, multichip module (MCM) manufacturing, power handling, high frequency modules and high temperature electronics for automotive applications. Our future investments in technology, processes and people will maintain us at the forefront of microelectronics design and assembly. Our commitment to partnership with our customers will remain the cornerstone of our strategy.

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